Printed-circuit-boards are intended for the enterprises of instrument-making, motor-car industry, VPK.
Number of layers 1 to 26
Term of delivery 5-6 weeks
Workpiece maximun dimension 610 x 530 mm
606 x 460 mm
File format P-CAD 4,5 - 8,5; ACCEL EDA; GERBER etc.
Material FR, СТФ etc.
Mask Karapays, Elpremer green
Marking paint Peters (Germany)
Lamella coating Ni (nikel), Pd (palladium)
- Equipment overall productivity - up to 30,000 components per hour.
- SMT production capacity (from quarter 2, 2003) - up to 200,000 sq dm per month.
- YAMAHA (Japan) glue/solder paste automatic dispensing device of up to 15,000 dots per hour productivity.
- Topaz - Assembleon (the Netherlands) SMD component pick-and-place, technical vision, mechanical centering system (with incorporated control programme optimizer). Simultaneous placement of up to 8 components: - chips of dimension down to 1x0.5 mm and ICs with leads pitch of down to 0.5 mm.
- Hotflow-ERSA (Germany) solder paste convection reflow and glue setting device. The computer incorpotated allows up to 250 preset oven temperature profiles to be stored.
- N-Wave - ERSA (Germany) dual-wave soldering device for soldering in nitrogen.
- Trion-Orbotech (Germany) automated solder joint visual inspection device.
- Testing ang setting with use of dedicated equipment.